It has uniform low current density distribution and excellent throwing and covering power, especially in low current areas and is superior to cyanide copper in these properties. E-Brite 5.0 Cu produces a non-porous, fine-grained, smooth, and dense ductile copper deposit.
Additional copper or nickel can be plated to thickness required.
The E-Brite 5.0 Cu formula solves the immersion problem in copper barrel plating. It plates directly onto zinc diecast (zamac), and the resulting plating sticks to the casting.
It has uniform low current density distribution and excellent throwing and covering power, especially in low current areas and is superior to cyanide copper in these properties. E-Brite 5.0 Cu produces a non-porous, fine-grained, smooth, and dense ductile copper deposit.
Additional copper or nickel can be plated to thickness required.