E-Brite 5.0 Cu Alkaline Non-Cyanide Process

It has uniform low current density distribution and excellent throwing and covering power, especially in low current areas and is superior to cyanide copper in these properties. E-Brite 5.0 Cu produces a non-porous, fine-grained, smooth, and dense ductile copper deposit.

Additional copper or nickel can be plated to thickness required.

The E-Brite 5.0 Cu formula solves the immersion problem in copper barrel plating. It plates directly onto zinc diecast (zamac), and the resulting plating sticks to the casting.

 

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It has uniform low current density distribution and excellent throwing and covering power, especially in low current areas and is superior to cyanide copper in these properties. E-Brite 5.0 Cu produces a non-porous, fine-grained, smooth, and dense ductile copper deposit.

Additional copper or nickel can be plated to thickness required.

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