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An ideal solution for plating when minimum thickness specifications must be met in low current density.
E-Brite Ultra Cu is an outstanding pre-plate copper strike for bright nickel, acid copper, tin, and solder plates.
An extremely bright, single-additive decorative process that works in both rack and barrel installations and can also be used for heavy deposit applications.
Boric acid-free high levelling bright nickel process which differentiates to electrolytes containing boric acid.