Choose a Plating Finish

An ideal solution for plating when minimum thickness specifications must be met in low current density. 

E-Brite 30/30 is an easy-to-use, one-tank process that eliminates the need for cyanide or pyrophosphates. Optimal adhesion allows for plating directly onto a variety of metals.

Leveling acid copper that smooths out rough surfaces for additional plating processes.

Boric acid-free high levelling bright nickel process which differentiates to electrolytes containing boric acid.