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  1. An ideal solution for plating when minimum thickness specifications must be met in low current density. 

  2. E-Brite 30/30 is an easy-to-use, one-tank process that eliminates the need for cyanide or pyrophosphates. Optimal adhesion allows for plating directly onto a variety of metals.


  3. Leveling acid copper that smooths out rough surfaces for additional plating processes.


  4. E-Brite CR offers higher cathode current efficiencies and high operational current densities. Easy-to-use, stain-free, and provides exceptional covering power.

  5. Brightener for Mixed Ammonium/Potassium-Chloride Bright Acid Zinc Plating. 

  6. E-Brite 2.0 Ag is a new EPi break-through electroplating technology, which can plate non cyanide silver directly on nickel surfaces (meeting all three types of ASTM B-700 and spec AMS 2411J), as well as plate directly on silver, brass, bronze and copper and does not require a separate silver strike on these substrates. 

  7. Brass-plating process, plating twice as fast as any other. Brass plating over bright nickel produces the bright finish often found on faucets and door hardware.

  8. A bright acid tin-plating process, which deposits a leveled, brilliant plate.

  9. A single-additive cyanide formulation that provides exceptional brilliance. Produces a smooth, ductile deposit, whether used with high or low cadmium levels.

  10. Produces a soft white-to-gray matte finish.

  11. Semi-bright, sulfur-free process for duplex nickel plating. Produces less breakdown product, resulting in less carbon and low electro-negative potential.

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