Electroplating

Electroplating is the process of using an electrical direct current to coat an electrically conductive object with a thin layer of metal. EPi offers a variety of high-quality electroplating processes that are ideal for all types of metal finishers. 

EPi has been a consistent leader in the electroplating industry, developing and perfecting its products for more than 60 years.

In 1954, EPi created the E-Brite 23-11, a single-additive cyanide copper process, and in 1961, it continued pioneering the single-additive nickel-plating process with the E-Brite 717. The company was the first to develop a production-proven, non-cyanide, non-pyrophosphate alkaline copper electroplating process, the E-Brite 30/30.

The E-Brite 205-K was developed as an ultra-bright and leveling acid copper-plating process. It produces exceptionally fast, bright, and ductile deposits with low internal stress, which is necessary for successful plating on plastics.

The latest innovation, the E-Brite 5.0 Cu, is our fifth-generation alkaline non-cyanide copper process.

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  1. Produces a soft white-to-gray matte finish.

  2. Brass-plating process, plating twice as fast as any other. Brass plating over bright nickel produces the bright finish often found on faucets and door hardware.

  3. A bright acid tin-plating process, which deposits a leveled, brilliant plate.

  4. Second Generation Non-Cyanide Alkaline Silver Plating Process. A ready-to-plate cyanide-free silver-plating process. Single maintenance additive perfect for bright silver plate for brush, electronic, industrial and decorative applications.

    Subtotal $74.80
  5. A single-additive cyanide formulation that provides exceptional brilliance. Produces a smooth, ductile deposit, whether used with high or low cadmium levels.

  6. E-Brite CR offers higher cathode current efficiencies and high operational current densities. Easy-to-use, stain-free, and provides exceptional covering power.

  7. An ideal solution for plating when minimum thickness specifications must be met in low current density. 

  8. Semi-bright, sulfur-free process for duplex nickel plating. Produces less breakdown product, resulting in less carbon and low electro-negative potential.

  9. E-Brite 2.0 Ag is a new EPi break-through electroplating technology, which can plate non cyanide silver directly on nickel surfaces (meeting all three types of ASTM B-700 and spec AMS 2411J), as well as plate directly on silver, brass, bronze and copper and does not require a separate silver strike on these substrates. 

  10. Brightener for Mixed Ammonium/Potassium-Chloride Bright Acid Zinc Plating. 

  11. The E-Kleen Defoamer is a non-silicone based defoaming application.

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