Electroplating is the process of using an electrical direct current to coat an electrically conductive object with a thin layer of metal. EPi offers a variety of high-quality electroplating processes that are ideal for all types of metal finishers.
EPi has been a consistent leader in the electroplating industry, developing and perfecting its products for more than 60 years.
In 1954, EPi created the E-Brite 23-11, a single-additive cyanide copper process, and in 1961, it continued pioneering the single-additive nickel-plating process with the E-Brite 717. The company was the first to develop a production-proven, non-cyanide, non-pyrophosphate alkaline copper electroplating process, the E-Brite 30/30.
The E-Brite 205-K was developed as an ultra-bright and leveling acid copper-plating process. It produces exceptionally fast, bright, and ductile deposits with low internal stress, which is necessary for successful plating on plastics.
The latest innovation, the E-Brite 5.0 Cu, is our fifth-generation alkaline non-cyanide copper process.
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Produces a soft white-to-gray matte finish.
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Brass-plating process, plating twice as fast as any other. Brass plating over bright nickel produces the bright finish often found on faucets and door hardware.
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Boric acid-free high levelling bright nickel process which differentiates to electrolytes containing boric acid.
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A bright acid tin-plating process, which deposits a leveled, brilliant plate.
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Second Generation Non-Cyanide Alkaline Silver Plating Process. A ready-to-plate cyanide-free silver-plating process. Single maintenance additive perfect for bright silver plate for brush, electronic, industrial and decorative applications.
Subtotal $74.80 -
A single-additive cyanide formulation that provides exceptional brilliance. Produces a smooth, ductile deposit, whether used with high or low cadmium levels.
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E-Brite CR offers higher cathode current efficiencies and high operational current densities. Easy-to-use, stain-free, and provides exceptional covering power.
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An ideal solution for plating when minimum thickness specifications must be met in low current density.
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Semi-bright, sulfur-free process for duplex nickel plating. Produces less breakdown product, resulting in less carbon and low electro-negative potential.
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E-Brite 2.0 Ag is a new EPi break-through electroplating technology, which can plate non cyanide silver directly on nickel surfaces (meeting all three types of ASTM B-700 and spec AMS 2411J), as well as plate directly on silver, brass, bronze and copper and does not require a separate silver strike on these substrates.
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Brightener for Mixed Ammonium/Potassium-Chloride Bright Acid Zinc Plating.
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The E-Kleen Defoamer is a non-silicone based defoaming application.
