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E-Brite 2.0 Ag is a new EPi break-through electroplating technology, which can plate non cyanide silver directly on nickel surfaces (meeting all three types of ASTM B-700 and spec AMS 2411J), as well as plate directly on silver, brass, bronze and copper and does not require a separate silver strike on these substrates.
Leveling acid copper that smooths out rough surfaces for additional plating processes.
An ideal solution for plating when minimum thickness specifications must be met in low current density.
The E-Brite 5.0 Cu formula solves the immersion problem in copper barrel plating. It plates directly onto zinc diecast (zamac), and the resulting plating sticks to the casting.
