11 Items

  • Position
  • Product Name
  • Price
  • Cleaner features
  1. E-Brite 2.0 Ag is a new EPi break-through electroplating technology, which can plate non cyanide silver directly on nickel surfaces (meeting all three types of ASTM B-700 and spec AMS 2411J), as well as plate directly on silver, brass, bronze and copper and does not require a separate silver strike on these substrates. 

  2. Leveling acid copper that smooths out rough surfaces for additional plating processes.

     

  3. An ideal solution for plating when minimum thickness specifications must be met in low current density. 

  4. E-Brite 50/50 is a unique cyanide-free alkaline process that's perfect for functional electronics.

  5. Semi-bright, sulfur-free process for duplex nickel plating. Produces less breakdown product, resulting in less carbon and low electro-negative potential.

  6. E-Brite 757 will produce bright ductile deposits which are free from laminations. It produces brilliant, white deposits of high clarity, reflectivity and depth. The deposit is active and can be chromium plated if specified. It can be used in barrel applications as well as cathode rod and air agitated rack installations. It is a single maintenance additive.

  7. An extremely bright, single-additive decorative process that works in both rack and barrel installations and can also be used for heavy deposit applications.

  8. Brass-plating process, plating twice as fast as any other. Brass plating over bright nickel produces the bright finish often found on faucets and door hardware.

  9. E-Brite Ultra Cu is an outstanding pre-plate copper strike for bright nickel, acid copper, tin, and solder plates.

     

  10. Brightener for Mixed Ammonium/Potassium-Chloride Bright Acid Zinc Plating. 

  11. Produces brilliant, level, and ductile deposits, even on difficult substrates such as cast iron and heat-treated or carbon-nitrided steel.

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