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E-Brite 30/30 is an easy-to-use, one-tank process that eliminates the need for cyanide or pyrophosphates. Optimal adhesion allows for plating directly onto a variety of metals.
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E-Brite Ultra Cu is an outstanding pre-plate copper strike for bright nickel, acid copper, tin, and solder plates.
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E-Brite 2.0 Ag is a new EPi break-through electroplating technology, which can plate non cyanide silver directly on nickel surfaces (meeting all three types of ASTM B-700 and spec AMS 2411J), as well as plate directly on silver, brass, bronze and copper and does not require a separate silver strike on these substrates.
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E-Brite 50/50 is a unique cyanide-free alkaline process that's perfect for functional electronics.