E-Brite 5.0 Cu has uniform low current density distribution and excellent throwing and covering power, especially in low current areas and is superior to cyanide copper in these properties. E-Brite 5.0 Cu produces a non-porous, fine-grained, smooth, and dense ductile copper deposit.
Additional copper or nickel can be plated to thickness required.
The E-Brite 5.0 Cu formula solves the immersion problem in copper barrel plating. It plates directly onto zinc diecast (zamac), and the resulting plating sticks to the casting.
E-Brite 5.0 Cu has uniform low current density distribution and excellent throwing and covering power, especially in low current areas and is superior to cyanide copper in these properties. E-Brite 5.0 Cu produces a non-porous, fine-grained, smooth, and dense ductile copper deposit.
Additional copper or nickel can be plated to thickness required.