Created for the preparation for copper for use with EPi's electroplating processes. Does not produce undesirable fumes, so no venting is required when using at room temperature. Produces a defined etch profile and consistent surface area. Does not contain phosphate, chromate, nitrate, fluoride, chloride, or ammonia. Concentration: 8–24 oz/gal. (Optimum 16 oz). Temperature: 65–90° F. Time: 2–10 minutes immersion.
A mildly acidic dry-salt mixture for use as an etchant and activator for copper.
Created for the preparation for copper for use with EPi's electroplating processes. Does not produce undesirable fumes, so no venting is required when using at room temperature. Produces a defined etch profile and consistent surface area. Does not contain phosphate, chromate, nitrate, fluoride, chloride, or ammonia. Concentration: 8–24 oz/gal. (Optimum 16 oz). Temperature: 65–90° F. Time: 2–10 minutes immersion.