Alkaline non-cyanide process
E-Brite Ultra Cu is an outstanding pre-plate copper strike for bright nickel, acid copper, tin, and solder plates.
Excellent for use as an EMI shield and decorative finishes. Easy to use with only one maintenance additive. Uniform low current density distribution with greater throwing power than cyanide copper. Produces a non-porous, fine-grained, smooth, and dense ductile copper deposit.
- E-Brite Ultra Cu TDS
- E-Brite Ultra Cu SDS
- E-Brite Ultra Cu pHa SDS
- E-Brite Ultra Cu-E SDS
- Alkaline Cyanide Free Copper Process
- E-Brite Ultra Cu Brochure
A room temperature, concentrated liquid neutral soak cleaner based on phosphates. Cleans water-soluble oils and petroleum and...
A heavy-duty liquid mixture of surface active agents, immersion desmutters, detergents, silicate, phosphates, and caustic that...
A mildly alkaline powdered mixture used as an electrolytic and soak cleaner. Contains highly fortified surface active agents,...
A mildly acidic liquid concentrate used to prepare diecast zinc surfaces for plating. Specifically formulated for use with EPi's...
Acid process Leveling acid copper that smooths out rough surfaces for additional plating processes. Produces exceptionally bright...Collapse Information