Alkaline non-cyanide process
E-Brite 30/30 is an easy-to-use, one-tank process that eliminates the need for cyanide or pyrophosphates. Optimal adhesion allows for plating directly onto a variety of metals.
Uniform low current density distribution with greater throwing power than cyanide copper. Produces a non-porous, fine-grained, smooth, and dense ductile copper deposit. Provides superior performance as a heat treat stop off copper plate and meets Boeing Commercial, Space and Defense Spec 5722.
- Safety Data Sheet (30/30)
- Safety Data Sheet (30/31)
- Safety Data Sheet (30/32)
- Safety Data Sheet (30/35)
- Technical Data Sheet
- Product Brochure
- Trouble Shooting Guide
Acid process Leveling acid copper that smooths out rough surfaces for additional plating processes. Produces exceptionally bright...Collapse Information
E-Brite 50/50 is a unique cyanide-free alkaline process that's perfect for functional electronics.
It's easy-to-maintain, single-additive process plates without a separate brightener additive, and a separate strike plate is not required on copper or brass as it is with cyanide. Not recommended for decorative uses.
Alkaline non-cyanide process E-Brite Ultra Cu is an outstanding pre-plate copper strike for bright nickel, acid copper, tin, and...
A liquid concentrate that inhibits corrosive attack for weeks to months, E-Tec 529 protects copper and copper-alloy parts while in...Collapse Information