For Industrial Use

E-Brite 202G

Acid process

Bright acid copper for high-speed plating of wire and grounding rods.

Excellent bath stability produces bright, ductile deposits with low internal stress, which is necessary for drawing or threading the finished product. Does not contain dye-type materials, which can stain and reduce the ductility of the deposit.

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E-Brite Ultra Cu

Alkaline non-cyanide process E-Brite Ultra Cu is an outstanding pre-plate copper strike for bright nickel, acid copper, tin, and...

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For Industrial Use

E-Brite 5.0 Cu

Alkaline non-cyanide process

The E-Brite 5.0 Cu formula solves the immersion problem in copper barrel plating. It plates directly onto zinc diecast (zamac), and the resulting plating sticks to the casting.

It has uniform low current density distribution and excellent throwing and covering power, especially in low current areas and is superior to cyanide copper in these properties. E-Brite 5.0 Cu produces a non-porous, fine-grained, smooth, and dense ductile copper deposit.

Additional copper or nickel can be plated to thickness required.

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E-Kleen 163

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E-Kleen 173

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E-Pik 216

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E-Brite 757

Bright process E-Brite 757 is a single-additive process that produces brilliant white deposits of high clarity, reflectivity, and...

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For Industrial Use

E-Brite Ultra Cu

Alkaline non-cyanide process

E-Brite Ultra Cu is an outstanding pre-plate copper strike for bright nickel, acid copper, tin, and solder plates.

Excellent for use as an EMI shield and decorative finishes. Easy to use with only one maintenance additive. Uniform low current density distribution with greater throwing power than cyanide copper. Produces a non-porous, fine-grained, smooth, and dense ductile copper deposit.

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E-Kleen 163

A ready-to-use liquid neutral soak cleaner based on phosphates. Cleans water-soluble oils and petroleum and emulsifies oil and...

E-Kleen 153

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E-Kleen 173

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E-Pik 216

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E-Brite 205-K

Acid process Leveling acid copper that smooths out rough surfaces for additional plating processes. Produces exceptionally bright...

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E-Brite Ultra Cu RTP

Alkaline non-cyanide process

This ready-to-plate formula is perfect for smaller applications, including brush plating.

E-Brite Ultra Cu RTP plates directly onto a variety of metals, and one bath serves as both strike and plate. The low copper concentration means less sludge generation. It meets MIL-C-14550 B and AMS 2418F requirements.

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Documentation
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E-Kleen 153

A heavy-duty liquid mixture of surface active agents, immersion desmutters, detergents, silicate, phosphates, and caustic that...

E-Kleen 173

A mildly alkaline powdered mixture used as an electrolytic and soak cleaner. Contains highly fortified surface active agents,...

E-Pik 216

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E-Brite 205-K

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E-Pik 215

A free-flowing metal activator and deoxidizer for steel, copper, brass, and zinc. Also used to activate zinc-plated surfaces,...

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For Industrial Use

E-Brite Ultra Cu-Mg

Magnesium process

E-Brite Ultra Cu-Mg produces excellent adhesion and corrosion protection on AZ91 magnesium castings.

Copper plating can achieve 24 hours of resistance and copper-nickel-chrome parts can achieve up to 96 hours, as was proven by ASTM B-117 salt spray testing. When used as a base plate beneath electroless nickel, it achieved 400 hours. Other parts cannot be baked without blistering.

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Documentation
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E-Brite 205-K

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For Industrial Use

E-Brite PC

Printed circuit board

High-throw bright acid copper and through-hole plating of printed circuit boards.

Produces very ductile results with deposits that are low in stress.

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Room Temperature 65–85° F

For Industrial Use

E-Brite 203

Acid process

Produces ductile and low-stress deposits over the entire recommended brightener range. Excellent throwing power in extreme low current density areas.

Does not contain dyes, eliminating buildup common to other acid copper processes. Recommended for rack electroforming and barrel plating of lead.

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Documentation
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E-Brite 23-11

Acid process An ideal solution for plating when minimum thickness specifications must be met in low current density.  After...

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For Industrial Use

E-Brite 205-K

Acid process

Leveling acid copper that smooths out rough surfaces for additional plating processes.

Produces exceptionally bright ductile deposits with low internal stress, ideal for successful plating on plastic. This single-additive process reduces costs and downtime from pitting problems and carbon treatment while increasing brightness. It is ideal for plating intricately shaped products.

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E-Brite 23-11

Acid process An ideal solution for plating when minimum thickness specifications must be met in low current density.  After...

E-Brite Ultra Cu

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E-Brite 757

Bright process E-Brite 757 is a single-additive process that produces brilliant white deposits of high clarity, reflectivity, and...

E-Brite 787

Bright process An extremely bright decorative nickel process formulated for appearance and thin nickel deposits. A single...

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For Industrial Use

E-Brite 23-11

Acid process

An ideal solution for plating when minimum thickness specifications must be met in low current density. 

After continual improvement, it does not decompose or breakdown products, cause blistering, peeling, or pitting like organic brighteners. The E-Brite 23-11, the fastest and brightest cyanide copper-plating process, produces fewer carbonates.

E-Brite 23-11 was the first single inorganic maintenance brightener additive for cyanide copper plating. 

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Documentation
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E-Kleen 173

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E-Kleen 163

A ready-to-use liquid neutral soak cleaner based on phosphates. Cleans water-soluble oils and petroleum and emulsifies oil and...

E-Pik 216

A mildly acidic liquid concentrate used to prepare diecast zinc surfaces for plating. Specifically formulated for use with EPi's...

E-Brite 205-K

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For Industrial Use

E-Brite 30/30

Alkaline non-cyanide process

E-Brite 30/30 is an easy-to-use, one-tank process that eliminates the need for cyanide or pyrophosphates. Optimal adhesion allows for plating directly onto a variety of metals.

Uniform low current density distribution with greater throwing power than cyanide copper. Produces a non-porous, fine-grained, smooth, and dense ductile copper deposit. Provides superior performance as a heat treat stop off copper plate and meets Boeing Commercial, Space and Defense Spec 5722.

 

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Documentation
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There is a small fee for samples shipped in the continental U.S. This can range from $10–$75. Products shipped outside the continental U.S. can be subject to certain restrictions. Freight charges may range from $75–$300.