Acid Copper

E-Brite Ultra AC – Acid Copper Plating is a new and unique single additive acid copper plating process which has shown to provide superior plate distribution by plating more copper in lower current density areas and reducing the copper thickness in higher current density areas. The ratio of plating thickness between high current areas and low current areas is a low 4:1. A significant advantage is reduced consumption of anodes when Ultra AC is plated at the same thickness of copper in the LCD as with other processes.

With the greater thickness in the LCD, cut-through when buffing and polishing the copper plate is virtually eliminated.

Click here for additional information on “How to Decrease Cut Through & Reduce Anode Consumption” with Brite Acid Copper Plating..

E-Brite 200 – Acid Copper Plating is an acid copper plating process which produces a highly leveled and exceptionally bright, ductile deposit with low internal stress.

It is the preferred acid copper process when an exceptional high degree of leveling is required.

The E-Brite 200 acid copper plating process is the fastest and best leveling acid copper available and is unsurpassed in brightness, ductility and resistance to treeing and burning. It is the easiest to buff acid copper on the market. The soft deposit will flow with buffing to cover defects in the base metal.

E-Brite 200 is a non-dye type process which yields extremely bright, ductile deposits with low internal stress. It also eliminates problems of adhesion of subsequent plating operations to the acid copper which can be a problem with dye type processes.

The E-Brite 200 bath exhibits excellent low current density brightness and leveling. It is tolerant to high temperatures (95-100F) and is resistant to contamination and it does not form breakdown products which have to be frequently carbon treated as with dye baths and other baths on the market. Carbon treatment of E-Brite 200 is less frequent than with all other acid copper baths. It does not load up with organics.

It has excellent tolerance to impurities, with excellent anti-burn and anti-treeing properties.

E-Brite 200 has very good brightness and coverage in low current density areas making it an ideal process for plating irregularly shaped parts.

It has excellent bath stability minimizing start-up problems and eliminates the need for adjustment after idle periods or weekend shut-downs.

It exhibits a high degree of leveling at all normal current density ranges which smoothes out rough surfaces for subsequent nickel/chrome plating. It exhibits reduced nodulation in high current density areas.

An E-Brite 200 bath is unique because it is easily maintained with a single maintenance additive – - another first for EPI – - making it very easy to control.

E-Brite 202 – Acid Copper Plating – Bright acid copper for high speed plating of wire and grounding rods.

E-Brite 202 produces exceptionally bright, ductile deposits with low internal stress which is necessary for drawing or threading the finished product.

E-Brite 202 does not contain dye-type materials which are messy to work with, can cause staining of the plated surfaces and reduce ductility of the deposit.

It produces consistent results due to excellent bath stability, minimizes start-up problems and eliminates the need for adjustments after idle periods or weekend shut-downs.

There are no harmful breakdown products which eliminates frequent carbon treatment. The bath is tolerant of variations in working conditions and impurities lending to ease of operation and process control

E-Brite 202 is formulated to eliminate high current density nodulations even at current densities over 800 asf.

E-Brite 203 – Acid Copper Plating

E-Brite 203 a high throw bright acid copper for Barrel and Rack plating. It produces ductile and low-stress deposits over the entire recommended brightener range. The bath exhibits excellent brightness and throwing power in extreme low current density areas.

E-Brite 203 is a functional process whereas E-Brite 200 produces the optimum in brightness and leveling. It is recommended for rack electroforming and barrel plating of lead after an appropriate strike.

It can be applied after a strike of E-Brite 23-11 cyanide copper or E-Brite Ultra Cu non-cyanide alkaline copper to build a bright layer of copper before nickel on steel, zinc diecast or other substrates.

E-Brite 203 does not contain dyes thus eliminating the buildup of undesirable decomposition products common to other acid copper processes.