E-Brite Ultra Cu
E-Brite Ultra-Cu is a unique non-cyanide alkaline copper plating process.
Today, American cyanide copper platers face Department of Homeland Security (DHS) regulations in reporting potassium and sodium cyanide. Switching to E-Brite Ultra Cu eliminates cyanide and the DHS regulations of reporting cyanide.
Watch our YouTube video for Copper Plating an iPod that was presented at SUR/FIN 2008.
You can also check out the copper plating experiment that PopSCI.com did using EPi’s electroplating chemicals. If you would like more information on electro plating, don’t miss our Electrochemical’s Blog for great information about the the metal plating industry, our products, and upcoming events.
EPi was the first with a heavy production proven, non-cyanide, non-pyrophosphate, alkaline copper plating process with E-Brite Ultra-Cu. It does the “impossible” by plating directly onto steel, brass, copper, stainless steel, zincated aluminum, electroless nickel, sulfamate nickel as well as diecast zinc surfaces with out a separate strike. Ultra Cu copper has outstanding adhesion to difficult-to-plate die-cast zinc surfaces. The single additive bath produces superior results in both barrel and rack installations as either a strike or plate bath. It covers better and has greater throwing power than cyanide copper.
Want more information about copper plating? Read our Copper Plating FAQ, or our Technical Paper about Alkaline Cyanide-Free Copper Plating Process for Functional and Decorative Plating.
E-Brite Ultra-Cu is an outstanding pre-plate copper strike for bright nickel, acid copper, tin and solder plates. It is an excellent heat treat stop off plate and EMI shield. It is also an excellent decorative finish for buttons, rivets, lighting fixtures and builders’ hardware. The copper plate can be readily blackened or oxidized for a variety of attractive antiqued finishes. There are no carbonates to be treated. It contains no strong chelators. It is supplied as a liquid concentrate which is diluted with water.
E-Brite Ultra-Cu produces a fine grained, smooth, dense and ductile copper deposit which is nonporous and has excellent bonding properties. The throwing and covering power of the non-cyanide process is superior to cyanide processes. This is especially evident in barrel plating. It has uniform low current density distribution with excellent micro-throw. It also has greater throwing power than acid copper.
The grain is smaller than cyanide copper which increases the density of the deposit. This density provides excellent heat treat stop off and masking properties. The fine grained E-Brite Ultra-Cu deposit under nickel/chrome improves the overall corrosion resistance and helps to throw the nickel farther into the low current density areas.
The E-Brite Ultra-Cu produces a softer and more ductile deposit than cyanide or acid copper. The soft deposit imparts improved adhesion and corrosion resistance and greatly improved resistance to thermal shock. It has a high deposit purity and hence no out-gassing with subsequent brazing, soldering or vacuum operations.
E-Brite Ultra-Cu is simple and inexpensive to use because it replenishes the copper in solution by dissolving the copper anode and here again it is a unique product with only one maintenance additive.